Parameters:
 - 4 layers, FR-4, 1.5mm
 - silkscreen: top only
 - drills: 303
 - all vias are through-all
 - min. trace width and spacing: 8 mil
 - min. drill diameter: 0.5mm
 - ENIG surface
 - milling
 - electrical test of every board mandatory
 - dimensions: 141x89mm

Mandatory colors:
 - top soldermask: white
 - bottom soldermask: white
 - top silkscreen: red

Notes:

1. CON3 pads: please make sure a slot (plated) is milled according to r.mil.
   If needed, adjust ground plane accordingly. The EDA tool we use does not
   support slots.

2. Silkscreen outside the board outline should be cut.

3. Layers stack:
 - t.gtl (top)
 - 2.g1  (l. 2)
 - 3.g2  (l. 3)
 - b.gbl (bottom)

4. LEDs should me mounted like in the attached picture: leds-mounting.jpg

